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NTHD4508N
Power MOSFET
20 V, 4.1 A, Dual N?Channel ChipFET t
Features
? Low R DS(on) and Fast Switching Speed
? Leadless ChipFET Package has 40% Smaller Footprint than TSOP?6
? Excellent Thermal Capabilities Where Heat Transfer is Required
? Pb?Free Package is Available
Applications
? DC?DC Buck/Boost Converters
? Battery and Low Side Switching in Portable Equipment Such as MP3
Players, Cell Phones, DSCs and PDAs
? Level Shifting
V (BR)DSS
20 V
http://onsemi.com
R DS(on) TYP
60 m W @ 4.5 V
80 m W @ 2.5 V
D 1 , D 2
I D MAX
4.1 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain?to?Source Voltage
Gate?to?Source Voltage
Symbol
V DSS
V GS
Value
20
± 12
Unit
V
V
G 1 , G 2
Continuous Drain
Current
Power Dissipation
Steady
State
t v 5s
Steady
T J = 25 ° C
T J = 85 ° C
T J = 25 ° C
T J = 25 ° C
I D
P D
3.0
2.2
4.1
1.13
A
W
S 1 , S 2
N?Channel MOSFET
ChipFET
CASE 1206A
State
t v 5s
T J = 85 ° C
T J = 25 ° C
0.59
2.1
STYLE 2
Pulsed Drain Current t p = 10 μ s
Operating Junction and Storage Temperature
I DM
T J ,
T STG
12
?55 to
150
A
° C
PIN
CONNECTIONS
MARKING
DIAGRAM
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T L
260
° C
D 1 8
1 S 1
1
8
THERMAL RESISTANCE RATINGS
D 1 7
2 G 1
2
7
Parameter
Junction?to?Ambient – Steady State
(Note 1)
Symbol
R θ JA
Max
110
Unit
° C/W
D 2 6
D 2 5
3 S 2
4 G 2
3
4
6
5
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
C8 = Specific Device Code
M = Month Code
ORDERING INFORMATION
Device
NTHD4508NT1
NTHD4508NT1G
Package
ChipFET
ChipFET
(Pb?Free)
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2004
October, 2004 ? Rev. 3
1
Publication Order Number:
NTHD4508N/D
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